Laser micromachining, Laser Engraving,laser marking and Cutting Machine manufacturer, Beyond laser intelligent equipment.

Picosecond Laser Machine for Precision cutting, dicing, scribing, depaneling extremely thin wafer, films or foils

Using picosecond UV laser system to cut Extremely thin wafer, films or foils can be very advantageous to your production process.

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Picosecond Laser Cutting Machine (Ultrashort-pulsed laser)

Using picosecond UV laser system to cut Extremely thin wafer, films or foils can be very advantageous to your production process.

·The laser beam allows for controlled fusing of foils and films

·The UV laser cutting is cold cutting, no damage on thin films or foils

·The laser produces clean and sealed cut edges

 ·The laser can cut even the smallest radii precisely

·The laser can cut simple geometries at record speed

·The laser is contact free, no pressure is exerted on the material

·The laser consistently produces perfect results

·The laser will not result in chipping of paint from the end product


The benefits of a laser cutting machine: Faster than a cutting plotter, more precise than punching dies, no damage on thin films, and more economical for small series up to 1,000 pieces.

How does laser cutting of foils and films work?

The controlled fusing of the material ensures clean cutting edges without any soiling. The laser offers many advantages when working with multilayer films: Several layers, such as backing, adhesive and top film, can be cut in one work step. Depending on the layer structure and the strength of the film, up to 10 layers can be cut in the composite material.

Why will I work faster with the laser than with a cutting plotter?

Precisely matched axis drives and an innovative control system ensure precise and fast laser cutting. Unlike in cutting plotters, there is no material resistance when lasers are used. As a result, laser cutting is faster. Another plus: The laser beam does not need to be lifted or rotated as a knife. Beyond laser systems make optimal use of this advantage in speed and detail, in particular when working on delicate geometries.

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Picosecond Laser Cutting Machine

Precision cutting, dicing, scribing, depaneling extremely thin wafer, films or foils etc. 

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Our laser equipment widely used in electronics, IC chips, electrical appliances, lighting fixtures, jewelry, bathroom accessory, instruments and meters, automobile and motorcycle accessories that defend bath, mobile communications parts, molds, precision machinery, medical equipment, IT digital metal shell, military aviation parts, garment leather, craft gifts, advertising, decoration, model, cookers, tableware, kitchen utensils and appliances and other industries. Beyond laser can provide a variety of automatic online laser marking, laser cutting equipment.

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Beyond Laser Corp

Shuitian 1st Road No.13,Tongle Community,Longgang District,Shenzhen,China 

Zip code: 518116

Tel:+86 755 89765109

Fax:86-75589765677

sales@chaoyuelaser.com

Mob:+86 18926522726





  



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